XPS Extruded Foam Board (XPS) and Foam Board (EPS) are materials commonly used for building insulation and thermal insulation. Their thermal insulation performance depends mainly on the thermal conductivity of the material, the lower the thermal conductivity, the better the thermal insulation effect.
XPS Extruded Foam Board (XPS): the thermal conductivity is generally between 0.024-0.038W/(m-K). Due to its closed-cell structure, it can effectively prevent the intrusion of moisture, and at the same time, it has high compressive strength, which makes it suitable for the heat insulation layer of roof, floor and wall.
Foam board (EPS): The thermal conductivity is generally between 0.03-0.04W/(m-K). It contains open pores in its structure, and although the thermal insulation effect is slightly inferior to that of extruded plastic boards, it is relatively low in cost and cost-effective, and is suitable for some occasions where the requirements for thermal insulation are not particularly high.
In general, if you have high requirements for thermal insulation performance and the budget allows, you can choose XPS Extruded Foam Board (XPS); if you pay more attention to cost-effective, then foam board (EPS) is a good choice. In actual application, you need to consider which material to choose according to the specific project requirements and budget.
